A hybrid photonic integration scheme based on flip-chip bonding combined with vertical coupling is presented in this work. offering a novel solution for the integration of active and passive chips. An offset quantum-well laser is flipped and bonded into the pre-set cavity of the passive chip. The light emitted from the laser propagates through a taper into the passive chip. https://safeersappliancers.shop/product-category/bosch-nbs533bb0b-electric-built-under-double-oven-black/